Design-Reuse2d
SiFive Highlights Key Inflection Points Driving RISC-V Adoption for AI and Introduces Intelligence XM Series for AI Workload Acceleration
This is the first IP from SiFive to include a highly scalable AI matrix engine, which accelerates time to market for ...
Design-Reuse2d
RaaS, a collaborative initiative, adopted Menta's eFPGA technology for RaaS Edge Computing platform
RaaS’s mission is to provide access as a service to the most advanced semiconductor technology (Research as a Service). RaaS ...
Design-Reuse4d
Arm Accelerates AI From Cloud to Edge With New PyTorch and ExecuTorch Integrations to Deliver Immediate Performance Improvements for Developers
Arm is announcing some significant new developments in our mission to make the developer experience as frictionless as ...
Design-Reuse3d
Accelerating RISC-V Processor Verification: A Co-Simulation Strategy
With RISC-V processor architectures gaining traction across diverse computing systems, ensuring their reliability through ...
Design-Reuse4d
Hearables Featuring AI are Gaining Traction
Our demand for ever higher quality audio devices continues to drive innovation. Mobility through hearables (earbuds, wireless ...
Design-Reuse3d
Joachim Kunkel Joins Arteris Board of Directors
Arteris, Inc. (Nasdaq: AIP), a leading provider of system IP which accelerates system-on-chip (SoC) creation, today announced ...
Design-Reuse4d
Expedera Appoints Siyad Ma as New CEO to Drive Expansion, Innovation
Expedera Inc., a leading provider of scalable Neural Processing Unit (NPU) semiconductor intellectual property (IP), ...
Design-Reuse4d
3 steps to shrinking your code size, your costs, and your power consumption
RISC-V is a powerful instruction set that is constantly evolving. One of the recent evolutions relates to code size reduction ...
Design-Reuse4d
Omni Design Technologies Partners with Aura Intelligent Systems on Next Generation Radar
Under the partnership agreement, Omni Design is providing custom, advanced Swift™ data converters, analog front-end (AFE), ...
Design-Reuse8d
Synopsys Introduces Industry's First 40G UCIe IP Solution to Power High-Performance Multi-Die Designs
With physical limitations slowing Moore’s law and AI pushing the limits of technology, compute requirements and the demand ...
Design-Reuse7d
Enosemi and GlobalFoundries announce the availability of silicon-validated electronic-photonic design IP available in the GF Fotonix platform
Enosemi, a silicon photonics chiplet and IP provider, announced today the availability of a portfolio of high-speed ...
Design-Reuse3d
Intel and AWS Expand Strategic Collaboration, Helping Advance U.S.-Based Chip Manufacturing
Intel to Produce Custom AI Fabric Chip on Intel 18A and Custom Xeon 6 Chip on Intel 3 for AWS; Multi-Year, ...